HEF4011UBP

Technical Characteristics

• Terminal Surface Treatment

  solder

• Design Function And Quantity

  2 gate, nand

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Height

  0.150 inches minimum and 0.180 inches maximum

• Body Width

  0.240 inches minimum and 0.260 inches maximum

• Body Length

  0.745 inches minimum and 0.770 inches maximum

• Terminal Type And Quantity

  14 printed circuit

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum propagation delay time, low to high level output and 50.00 nanoseconds maximum propagation delay time, high to low level output

• Voltage Rating And Type Per Characteristic

  15.0 volts maximum power source

• Input Circuit Pattern

  dual 4 input

• Inclosure Configuration

  dual-in-line

• Inclosure Material

  plastic

• Features Provided

  low power and monolithic

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Operating Temp Range

  -40.0 to 85.0 deg celsius

• Maximum Power Dissipation Rating

  500.0 milliwatts