MIL-C-55681/4

Technical Characteristics

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Test Data Document

  81349-mil-c-55681 specification

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Tolerance Range Per Section

  -0.10 to 0.10 picofarads single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0 to 20.0 single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Center To Center Distance Between Terminals Parallel To Length

  0.080 inches nominal

• Body Width

  0.110 inches nominal

• Overall Height

  0.058 inches minimum and 0.102 inches maximum

• Terminal Length

  0.015 inches nominal

• Overall Length

  0.110 inches nominal

• Reliability Indicator

  established

• Terminal Surface Treatment

  solder

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Case Material

  ceramic or glass

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  1.400 picofarads single section

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Height

  0.058 inches minimum and 0.102 inches maximum

• Body Length

  0.110 inches nominal

• Overall Width

  0.110 inches nominal

• Reliability Failure Rate Level In Percent

  1.0000

• Body Style

  45a chip type