TMC3163

Technical Characteristics

• Body Width

  0.240 inches minimum and 0.260 inches maximum

• Body Height

  0.030 inches minimum and 0.070 inches maximum

• Features Provided

  hermetically sealed and monolithic and wire-or outputs

• Inclosure Material

  ceramic

• Input Circuit Pattern

  10 input

• Word Quantity

  16

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  35.00 nanoseconds maximum propagation delay time,low to high level output and 35.00 nanoseconds maximum propagation delay time,high to low level output

• Unpackaged Unit Weight

  0.3 grams

• Body Length

  0.240 inches minimum and 0.275 inches maximum

• Maximum Power Dissipation Rating

  250.0 milliwatts

• Operating Temp Range

  m55.0/p125.0 deg celsius

• Storage Temp Range

  m65.0/p150.0 deg celsius

• End Item Identification

  cecom equip 80063

• Inclosure Configuration

  flat pack

• Output Logic Form

  transistor-transistor logic

• Bit Quantity

  16

• Case Outline Source And Designator

  t0-86 joint electron device engineering council

• Voltage Rating And Type Per Characteristic

  m1.5 volts minimum power source and 5.5 volts maximum power source

• Memory Device Type

  rom

• Terminal Type And Quantity

  14 flat leads