ROM/PROM

Technical Characteristics

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Terminal Type And Quantity

  24 printed circuit

• Body Length

  1.290 inches maximum

• Bit Quantity (Non-Core)

  16384

• Body Height

  0.210 inches maximum

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Memory Device Type

  prom

• Operating Temp Range

  -55.0/+110.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Features Provided

  monolithic and 3-state output and hermetically sealed and electrostatic sensitive and programmed

• Case Outline Source And Designator

  d-3 mil-m-38510

• Inclosure Material

  ceramic

• Body Width

  0.610 inches maximum

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Input Circuit Pattern

  11 input

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source