ROM/PROM

Technical Characteristics

• Iii Unpackaged Unit Weight

  6.5 grams

• Memory Device Type

  rom

• Terminal Surface Treatment

  solder

• Case Outline Source And Designator

  d-3 mil-m-38510

• Features Provided

  hermetically sealed and burn in and programmable and w/enable

• Maximum Power Dissipation Rating

  1.02 watts

• Body Height

  0.210 inches maximum

• Terminal Type And Quantity

  24 printed circuit

• Test Data Document

  96906-mil-std-883 standard

• Time Rating Per Chacteristic

  90.00 nanoseconds maximum propagation delay time, low to high level output and 90.00 nanoseconds maximum propagation delay time, high to low level output

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source

• (Non-Core Data) Word Quantity

  512

• (Non-Core Data) Bit Quantity

  4096

• Input Circuit Pattern

  13 input

• Output Logic Form

  transistor-transistor logic

• Inclosure Configuration

  dual-in-line

• Inclosure Material

  ceramic

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Body Length

  1.290 inches maximum