ROM/PROM

Technical Characteristics

• Inclosure Material

  ceramic

• Body Height

  0.125 inches maximum

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Inclosure Configuration

  dual-in-line

• Bit Quantity (Non-Core)

  512

• Terminal Type And Quantity

  22 printed circuit

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Word Quantity (Non-Core)

  64

• Body Width

  0.393 inches maximum

• Body Length

  1.105 inches maximum

• Input Circuit Pattern

  19 input

• Voltage Rating And Type Per Characteristic

  0.3 volts maximum power source

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Features Provided

  electrically alterable and erasable and w/clock

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom