8102401XB

Technical Characteristics

• Maximum Power Dissipation Rating

  200.0 milliwatts

• Operating Temp Range

  m55.0/p125.0 deg celsius

• Storage Temp Range

  m65.0/p150.0 deg celsius

• Features Provided

  monolithic and static operation

• Inclosure Material

  ceramic

• Input Circuit Pattern

  15 input

• Word Quantity

  4096

• Terminal Surface Treatment

  solder

• Test Data Document

  14933-81024 drawing

• Terminal Type And Quantity

  18 flat leads

• Memory Device Type

  ram

• Time Rating Per Chacteristic

  120.00 nanoseconds maximum propagation delay time,low to high level output

• Voltage Rating And Type Per Characteristic

  m0.3 volts minimum power source and 7.0 volts maximum power source

• Case Outline Source And Designator

  c-9 mil-m-38510

• Bit Quantity

  4096

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Inclosure Configuration

  flat pack

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• Body Width

  0.280 inches minimum and 0.305 inches maximum

• Body Length

  0.345 inches minimum and 0.365 inches maximum