82008F1JB

Technical Characteristics

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Case Outline Source And Designator

  d-3 mil-m-38510

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Bit Quantity (Non-Core)

  32768

• Word Quantity (Non-Core)

  4096

• Inclosure Configuration

  dual-in-line

• Terminal Type And Quantity

  24 printed circuit

• Input Circuit Pattern

  14 input

• Body Length

  1.290 inches maximum

• Output Logic Form

  transistor-transistor logic

• Body Height

  0.210 inches maximum

• Features Provided

  w/enable and static operation and parallel operation and positive outputs and monolithic and hermetically sealed and burn in and programmable and w/independent outputs and w/buffered output and bipolar and w/totem pole output and reliability screening

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Maximum Power Dissipation Rating

  1.04 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• ~1

  required and 3-state output