ROM/PROM

Technical Characteristics

• Body Length

  0.560 inches maximum

• Body Width

  0.458 inches maximum

• Body Height

  0.120 inches maximum

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Output Logic Form

  metal oxide-semiconductor logic

• Input Circuit Pattern

  24 input

• Bit Quantity

  8192

• Word Quantity

  1024

• Case Outline Source And Designator

  c-12 mil-m-38510

• Time Rating Per Chacteristic

  120.00 nanoseconds maximum propagation delay time, low to high level output and 120.00 nanoseconds maximum propagation delay time, high to low level output

• Terminal Type And Quantity

  32 leadless

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  electrostatic sensitive and hermetically sealed and bidirectional and burn in and w/enable

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Memory Device Type

  rom

• Test Data Document

  96906-mil-std-883 standard