8504157-799

Technical Characteristics

• Body Length

  0.540 inches minimum and 0.560 inches maximum

• Body Width

  0.342 inches minimum and 0.358 inches maximum

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Features Provided

  hermetically sealed and burn in and w/enable and bidirectional and electrostatic sensitive

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Input Circuit Pattern

  22 input

• Word Quantity

  16384

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  85.00 nanoseconds maximum propagation delay time, low to high level output and 85.00 nanoseconds maximum propagation delay time, high to low level output

• Maximum Power Dissipation Rating

  1.0 watts

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Bit Quantity

  65536

• Case Outline Source And Designator

  d-11 mil-m-38510

• Voltage Rating And Type Per Characteristic

  -0.5 volts maximum power source and 7.0 volts maximum power source

• Memory Device Type

  ram

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  28 leadless