810AS2509

Technical Characteristics

• Body Length

  1.245 inches maximum

• Body Height

  0.185 inches maximum

• Storage Temp Range

  -65.0/+125.0 deg celsius

• Output Logic Form

  metal oxide-semiconductor logic

• Operating Temp Range

  -0.0/+70.0 deg celsius

• Memory Device Type

  rom

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  525.0 milliwatts

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Input Circuit Pattern

  13 input

• Terminal Type And Quantity

  24 printed circuit

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source

• Features Provided

  programmable and ultraviolet erasable and static operation

• Body Width

  0.545 inches maximum

• Bit Quantity (Non-Core)

  16384