5962-8202504BYB

Technical Characteristics

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Time Rating Per Chacteristic

  300.00 nanoseconds maximum propagation delay time, low to high level output and 300.00 nanoseconds maximum propagation delay time, high to low level output

• Features Provided

  hermetically sealed and programmable and ultraviolet erasable and monolithic

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  17 input

• Body Length

  1.490 inches maximum

• Memory Device Type

  prom

• Body Height

  0.165 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Bit Quantity (Non-Core)

  131072

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Word Quantity (Non-Core)

  16384

• Terminal Type And Quantity

  28 printed circuit

• Case Outline Source And Designator

  d-10 mil-m-38510

• Inclosure Configuration

  dual-in-line

• Voltage Rating And Type Per Characteristic

  0.6 volts minimum total supply and 6.3 volts maximum total supply

• Current Rating Per Characteristic

  50.00 milliamperes forward current, nonrepetitive, maximum peak total value minor