5962-8201006BZB
Microcircuits, Electronic
MICROCIRCUIT,MEMORY
5962-8201006BZB
5962 - Microcircuits, Electronic
MICROCIRCUIT,MEMORY
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Technical Characteristics
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Body Height
0.120 inches maximum
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Inclosure Material
ceramic and glass
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Input Circuit Pattern
12 input
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Body Length
0.440 inches maximum
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Terminal Surface Treatment
solder
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Maximum Power Dissipation Rating
1.0 watts
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Time Rating Per Chacteristic
150.00 nanoseconds maximum propagation delay time, low to high level output and 150.00 nanoseconds maximum propagation delay time, high to low level output
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Inclosure Configuration
leadless flat pack
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Storage Temp Range
-65.0/+150.0 deg celsius
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Case Outline Source And Designator
c-10 mil-m-38510
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Memory Device Type
ram
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Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
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Voltage Rating And Type Per Characteristic
-1.5 volts maximum power source and 7.0 volts maximum power source
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Terminal Type And Quantity
18 leadless
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Features Provided
w/strobe and burn in and hermetically sealed and monolithic and w/buffered output
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Word Quantity (Non-Core)
65536
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Body Width
0.290 inches maximum
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Bit Quantity (Non-Core)
65536
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Operating Temp Range
-55.0/+125.0 deg celsius
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Output Logic Form
n-type metal oxide-semiconductor logic