82009

Technical Characteristics

• Body Width

  0.420 inches maximum

• ~1

  ic

• Body Length

  0.640 inches maximum

• Body Height

  0.090 inches maximum

• Maximum Power Dissipation Rating

  1.04 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  flat pack

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  14 input

• Features Provided

  hermetically sealed and burn in and programmable and 3-state output and monolith

• Inclosure Material

  ceramic and glass

• Bit Quantity

  65536

• Word Quantity

  8192

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  -0.7 volts minimum power source and 7.0 volts maximum power source

• ~1

  100.00 nanoseconds maximum propagation delay time, high to low level output

• Case Outline Source And Designator

  f-6 mil-m-38510

• Time Rating Per Chacteristic

  100.00 nanoseconds maximum propagation delay time, low to high level output and

• Memory Device Type

  rom

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  24 flat leads