5962-8200901BZB

Technical Characteristics

• Maximum Power Dissipation Rating

  1.04 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  14 input

• Case Outline Source And Designator

  c-12 mil-m-38510

• ~1

  maximum absolute input

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum total supply and 7.0 volts maximum total supply and 5.5 volts

• Time Rating Per Chacteristic

  100.00 nanoseconds maximum propagation delay time, low to high level output and

• Test Data Document

  96906-mil-std-883 standard

• Body Length

  0.560 inches maximum

• Body Width

  0.458 inches maximum

• Body Height

  0.120 inches maximum

• ~1

  ic

• Features Provided

  hermetically sealed and burn in and programmable and 3-state output and monolith

• Inclosure Material

  ceramic and glass

• Bit Quantity

  65536

• Word Quantity

  8192

• Current Rating Per Characteristic

  100.00 milliamperes maximum output sink

• Terminal Surface Treatment

  solder

• ~1

  100.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  prom

• Terminal Type And Quantity

  32 leadless