5962-8201001BZB

Technical Characteristics

• Body Width

  0.290 inches maximum

• Body Height

  0.120 inches maximum

• Maximum Power Dissipation Rating

  1.0 watts

• Features Provided

  hermetically sealed and burn in and monolithic and dynamic and w/strobe

• Inclosure Material

  ceramic and glass

• Inclosure Configuration

  leadless flat pack

• Bit Quantity

  65536

• ~1

  150.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  rom

• Terminal Type And Quantity

  18 leadless

• Body Length

  0.440 inches maximum

• Operating Temp Range

  -55.0/+110.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Input Circuit Pattern

  12 input

• Word Quantity

  65536

• Case Outline Source And Designator

  c-10 mil-m-38510

• Terminal Surface Treatment

  gold

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Time Rating Per Chacteristic

  150.00 nanoseconds maximum propagation delay time, low to high level output and

• Precious Material And Location

  terminal surface option gold

• Precious Material

  gold

• Test Data Document

  96906-mil-std-883 standard