5962-8202103BXB

Technical Characteristics

• Body Height

  0.120 inches maximum

• Maximum Power Dissipation Rating

  1.75 watts

• Features Provided

  fixed and hermetically sealed and burn in and monolithic and w/enable and w/reset

• Body Width

  0.962 inches maximum

• Bit Quantity (Non-Core)

  16

• Input Circuit Pattern

  27 input

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Operating Temp Range

  -55.0/+110.0 deg celsius

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 7.0 volts maximum power source

• Body Length

  0.962 inches maximum

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Design Function And Quantity

  1 microprocessor

• Case Outline Source And Designator

  c-7 mil-m-38510

• Terminal Type And Quantity

  68 leadless