ROM/PROM

Technical Characteristics

• Body Width

  0.300 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic and glass

• Input Circuit Pattern

  10 input

• Case Outline Source And Designator

  f-9 mil-m-38510

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  25.00 nanoseconds maximum propagation delay time, low to high level output and 2

• Current Rating Per Characteristic

  100.00 milliamperes nominal output

• Output Logic Form

  transistor-transistor logic

• Inclosure Configuration

  flat pack

• Features Provided

  hermetically sealed and burn in and programmable and positive outputs

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Body Height

  0.092 inches maximum

• Body Length

  0.540 inches maximum

• Terminal Type And Quantity

  20 flat leads

• Test Data Document

  96906-mil-std-883 standard

• Memory Device Type

  pal

• ~1

  5.00 nanoseconds maximum propagation delay time, high to low level output

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source