8103608SA

Technical Characteristics

• Body Length

  0.540 inches maximum

• Body Height

  0.092 inches maximum

• Memory Device Type

  pal

• Inclosure Configuration

  flat pack

• Current Rating Per Characteristic

  100.00 milliamperes forward current, maximum peak total value not applicable

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Output Logic Form

  transistor-transistor logic

• Body Width

  0.300 inches maximum

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  1.0 watts

• Inclosure Material

  ceramic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Input Circuit Pattern

  10 input

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Case Outline Source And Designator

  f-9 mil-m-38510

• Time Rating Per Chacteristic

  25.00 nanoseconds maximum delay

• Features Provided

  burn in and hermetically sealed and monolithic and positive outputs

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Terminal Type And Quantity

  20 flat leads