5962-8515203BXX

Technical Characteristics

• Time Rating Per Chacteristic

  120.00 nanoseconds maximum propagation delay time, low to high level output and 120.00 nanoseconds maximum propagation delay time, high to low level output

• Word Quantity (Non-Core)

  262144

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Features Provided

  hermetically sealed and burn in and dynamic and w/enable and w/strobe

• Bit Quantity (Non-Core)

  262144

• Terminal Type And Quantity

  18 leadless

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Memory Device Type

  ram

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Current Rating Per Characteristic

  50.00 milliamperes forward current, maximum peak total value not applicable

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum total supply

• Body Height

  0.100 inches maximum

• Body Width

  0.305 inches maximum

• Input Circuit Pattern

  13 input

• Body Length

  0.505 inches maximum