ROM/PROM

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Height

  0.114 inches maximum

• Current Rating Per Characteristic

  120.00 milliamperes reverse current, dc absolute

• Time Rating Per Chacteristic

  35.00 nanoseconds maximum delay

• Memory Device Type

  prom

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Terminal Type And Quantity

  28 leadless

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Maximum Power Dissipation Rating

  413.0 milliwatts

• Body Width

  0.458 inches maximum

• Features Provided

  programmed and high speed and monolithic and burn in and hermetically sealed and electrostatic sensitive

• Body Length

  0.458 inches maximum

• Word Quantity (Non-Core)

  2048

• Input Circuit Pattern

  14 input

• Bit Quantity (Non-Core)

  16384