5962-8772301BEX

Technical Characteristics

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Body Length

  0.840 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Terminal Type And Quantity

  16 printed circuit

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Body Height

  0.185 inches maximum

• Case Outline Source And Designator

  d-2 mil-m-38510

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  220.00 nanoseconds maximum propagation delay time, low to high level output and 220.00 nanoseconds maximum propagation delay time, high to low level output

• Inclosure Configuration

  dual-in-line

• Features Provided

  monolithic and high speed and hermetically sealed

• Input Circuit Pattern

  13 input

• Design Function And Quantity

  1 gate, nand