HLMP-3762
Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,DIODE
HLMP-3762
5961 - Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,DIODE
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Technical Characteristics
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Inclosure Material
plastic
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Overall Diameter
0.188 inches minimum and 0.200 inches maximum
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Mounting Method
terminal
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Semiconductor Material
gallium arsenide phosphide
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Terminal Type And Quantity
2 uninsulated wire lead
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Overall Length
0.332 inches minimum and 0.362 inches maximum