X2864ADMB-25

Technical Characteristics

• Body Length

  1.435 inches minimum and 1.485 inches maximum

• Body Width

  0.515 inches minimum and 0.600 inches maximum

• Inclosure Material

  ceramic

• Inclosure Configuration

  dual-in-line

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Input Circuit Pattern

  24 input

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  28 printed circuit

• Body Height

  0.140 inches minimum and 0.175 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  programmable and erasable and w/enable and hermetically sealed

• Bit Quantity

  65536

• Word Quantity

  8192

• Voltage Rating And Type Per Characteristic

  -1.0 volts minimum power source and 6.0 volts maximum power source

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum propagation delay time, low to high level output and 250.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  rom

• Test Data Document

  96906-mil-std-883 standard