2690779-15

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Terminal Surface Treatment

  solder

• Insulation Resistance At Maximum Operating Temp

  100.0 megohm-microfarads

• Body Height

  0.079 inches maximum

• Body Length

  0.165 inches minimum and 0.189 inches maximum

• Overall Width

  0.240 inches minimum and 0.264 inches maximum

• Body Style

  45a chip type

• Dissipation Factor At Reference Temp In Percent

  2.500

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Case Material

  ceramic

• Tolerance Range Per Section

  -20.00 to 20.00 percent single section

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0 to 15.0 without voltage applied single section

• Capacitance Value Per Section

  0.680 microfarads single section

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Width

  0.240 inches minimum and 0.264 inches maximum

• Overall Height

  0.079 inches maximum

• Terminal Length

  0.010 inches minimum and 0.040 inches maximum

• Overall Length

  0.165 inches minimum and 0.189 inches maximum

• Reliability Indicator

  not established