5962-3829205BXB

Technical Characteristics

• Test Data Document

  81349-mil-m-38510 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Specification/Standard Data

  81349-mil-m-38510/292 government specification

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  65536

• Body Height

  0.210 inches nominal

• Body Length

  1.490 inches maximum

• Input Circuit Pattern

  21 input

• Features Provided

  hermetically sealed and monolithic and asynchronous and w/enable

• Memory Device Type

  ram

• Word Quantity (Non-Core)

  8192

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Time Rating Per Chacteristic

  150.00 nanoseconds maximum propagation delay time, low to high level output and 150.00 nanoseconds maximum propagation delay time, high to low level output

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Terminal Type And Quantity

  28 printed circuit

• Case Outline Source And Designator

  d-10 mil-m-38510

• Inclosure Configuration

  dual-in-line

• ~1

  data on certain environmental and performanc