82008

Technical Characteristics

• Iii Overall Height

  0.385 inches maximum

• Body Width

  0.310 inches maximum

• Maximum Power Dissipation Rating

  1.04 watts

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  bipolar and

• Features Provided

  burn in and

• Features Provided

  programmable and

• Features Provided

  w/enable

• Inclosure Material

  ceramic

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  14 input

• Case Outline Source And Designator

  d-9 mil-m-38510

• Current Rating Per Characteristic

  100.00 milliamperes nominal output

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum propagation delay time, low to high level output and

• Memory Device Type

  rom

• Definitive Government Spec/Std Reference

  8200804lc

• Non-Definitive Government Spec/Std Reference

  82008

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  24 printed circuit

• Manufacturers Code

  67268

• Iii Unpackaged Unit Weight

  6.5 grams

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum propagation delay time, high to low level output

• Terminal Surface Treatment

  solder

• Word Quantity

  4096

• Bit Quantity

  32768

• Output Logic Form

  bipolar metal-oxide semiconductor

• Features Provided

  schottky and

• Features Provided

  hermetically sealed and

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Body Height

  0.185 inches maximum

• Body Height

  0.140 inches minimum and

• Body Width

  0.220 inches minimum and

• Body Length

  1.280 inches maximum