ROM/PROM HEAD 133

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Memory Device Type

  pal

• Features Provided

  bipolar and burn in and hermetically sealed and programmable and monolithic

• Maximum Power Dissipation Rating

  303.0 milliwatts

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum propagation delay time, low to high level output and 50.00 nanoseconds maximum propagation delay time, high to low level output

• Body Height

  0.140 inches minimum and 0.185 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Case Outline Source And Designator

  d-8 mil-m-38510

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Body Length

  1.060 inches maximum

• Terminal Type And Quantity

  20 printed circuit

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  14 input

• Output Logic Form

  transistor-transistor logic