MD2716M/B

Technical Characteristics

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Height

  0.150 inches minimum and 0.210 inches maximum

• Memory Device Type

  prom

• Features Provided

  burn in and w/enable and programmed and hermetically sealed and ultraviolet erasable

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Case Outline Source And Designator

  d-3 mil-m-38510

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 6.0 volts maximum power source

• Input Circuit Pattern

  12 input

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Terminal Type And Quantity

  24 printed circuit

• Maximum Power Dissipation Rating

  635.0 milliwatts

• Body Length

  1.290 inches maximum

• Time Rating Per Chacteristic

  450.00 nanoseconds maximum propagation delay time, high to low level output and 450.00 nanoseconds maximum propagation delay time, low to high level output

• Bit Quantity (Non-Core)

  16384