5962-86859

Technical Characteristics

• Memory Device Type

  ram

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Terminal Type And Quantity

  28 leadless

• Inclosure Material

  ceramic

• Case Outline Source And Designator

  c-11 mil-m-38510

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Bit Quantity (Non-Core)

  16384

• Features Provided

  bidirectional and hermetically sealed and monolithic and burn in and w/enable

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Width

  0.342 inches minimum and 0.358 inches maximum

• Current Rating Per Characteristic

  140.00 milliamperes reverse current, dc absolute

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Input Circuit Pattern

  22 input

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Length

  0.540 inches minimum and 0.560 inches maximum