ROM/PROM

Technical Characteristics

• Body Width

  0.442 inches minimum and 0.458 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Inclosure Configuration

  leadless flat pack

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  788.0 milliwatts

• Word Quantity (Non-Core)

  2048

• Bit Quantity (Non-Core)

  16384

• Features Provided

  burn in and w/enable and programmable and hermetically sealed and electrostatic sensitive and erasable

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum propagation delay time, low to high level output and 250.00 nanoseconds maximum propagation delay time, high to low level output

• Terminal Type And Quantity

  32 leadless

• Output Logic Form

  metal oxide-semiconductor logic

• Input Circuit Pattern

  22 input

• Voltage Rating And Type Per Characteristic

  6.0 volts maximum power source

• Body Height

  0.054 inches minimum and 0.088 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Length

  0.540 inches minimum and 0.560 inches maximum