100-AD239/228-76

Microcircuits, Electronic

MICROCIRCUIT,MEMORY

100-AD239/228-76

5962-01-304-1401

5962 - Microcircuits, Electronic

Northrop Grumman Defense Mission

MICROCIRCUIT,MEMORY

ACT NOW! SUBMIT A QUICK QUOTE.

Technical Characteristics

  • Body Width

    0.500 inches minimum and 0.610 inches maximum

  • Output Logic Form

    n-type metal oxide-semiconductor logic

  • Time Rating Per Chacteristic

    err-060 nominal hand pull and err-060 nominal hand

  • Operating Temp Range

    -55.0/+125.0 deg celsius

  • Body Height

    0.172 inches minimum and 0.217 inches maximum

  • Inclosure Configuration

    dual-in-line

  • Case Outline Source And Designator

    d-10 mil-m-38510

  • Terminal Type And Quantity

    28 printed circuit

  • Word Quantity (Non-Core)

    16384

  • Terminal Surface Treatment

    solder

  • Maximum Power Dissipation Rating

    1.0 watts

  • Inclosure Material

    ceramic

  • Bit Quantity (Non-Core)

    131072

  • Memory Device Type

    rom

  • Storage Temp Range

    -65.0/+150.0 deg celsius

  • Test Data Document

    96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

  • Memory Capacity

    unknown

  • Body Length

    1.490 inches maximum

  • Input Circuit Pattern

    17 input

  • Features Provided

    ultraviolet erasable and burn in and hermetically sealed and programmable

  • Voltage Rating And Type Per Characteristic

    -0.3 volts minimum power source and 7.0 volts maximum power source

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
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Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
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Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
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