BDX66C

Technical Characteristics

• Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

  to-3

• Overall Length

  1.573 inches maximum

• Special Features

  junction pattern arrangement: pnp

• Features Provided

  hermetically sealed case

• Overall Width

  1.050 inches maximum

• Semiconductor Material

  silicon

• Power Rating Per Characteristic

  150.0 watts small-signal input power, common-collector minimum

• Terminal Type And Quantity

  2 pin and 1 case

• Mounting Facility Quantity

  2

• Transfer Ratio

  1.0 nominal static forward current transfer ratio, common-emitter

• Internal Configuration

  junction contact-darlington connected

• Maximum Operating Temp Per Measurement Point

  200.0 deg celsius junction

• Mounting Method

  unthreaded hole

• Inclosure Material

  metal

• Current Rating Per Characteristic

  20.00 amperes source cutoff current maximum

• Overall Height

  0.450 inches maximum

• Voltage Rating In Volts Per Characteristic

  120.0 maximum breakdown voltage, collector-to-base, emitter open