5962-8866202BYX

Technical Characteristics

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  262144

• Current Rating Per Characteristic

  20.00 milliamperes reverse current, dc blank

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Features Provided

  static operation and hermetically sealed and burn in and w/enable

• Case Outline Source And Designator

  c-12 mil-m-38510

• Input Circuit Pattern

  26 input

• Terminal Type And Quantity

  32 leadless

• Word Quantity (Non-Core)

  32768

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum propagation delay time, low to high level output and 70.00 nanoseconds maximum propagation delay time, high to low level output

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Length

  0.540 inches minimum and 0.560 inches maximum

• Memory Device Type

  ram

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Width

  0.442 inches minimum and 0.458 inches maximum