ROM/PROM HEAD 138

Technical Characteristics

• Inclosure Material

  ceramic

• Overall Height

  0.400 inches maximum

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Overall Length

  1.280 inches maximum

• Case Outline Source And Designator

  d-9 mil-m-38510

• Memory Device Type

  eprom

• Inclosure Configuration

  dual-in-line

• Terminal Type And Quantity

  24 printed circuit

• Body Height

  5.59 millimeters minimum and 7.87 millimeters maximum

• Input Circuit Pattern

  15 input

• Body Width

  4.40 millimeters maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Word Quantity (Non-Core)

  8192

• Overall Width

  0.320 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Current Rating Per Characteristic

  120.00 milliamperes reverse current, dc absolute

• Features Provided

  burn in and monolithic and programmable and ultraviolet erasable

• Bit Quantity (Non-Core)

  65536

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  32.51 millimeters maximum