ROM/PROM FAMILY 170

Technical Characteristics

• Bit Quantity (Non-Core)

  4096

• Maximum Power Dissipation Rating

  880.0 milliwatts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum access

• Body Height

  0.185 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Memory Device Type

  prom

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Case Outline Source And Designator

  d-8 mil-m-38510

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Features Provided

  hermetically sealed and high speed and bipolar and burn in and monolithic and programmed

• Body Length

  1.060 inches maximum

• Terminal Type And Quantity

  20 printed circuit

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  13 input

• Word Quantity (Non-Core)

  512