53S3281BW883B

Technical Characteristics

• Body Length

  0.640 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  hermetically sealed and burn in and programmable and schottky and bipolar and electrostatic sensitive

• Inclosure Configuration

  flat pack

• Output Logic Form

  transistor-transistor logic

• (Non-Core Data) Bit Quantity

  32768

• Case Outline Source And Designator

  f-6 mil-m-38510

• Body Width

  0.300 inches minimum and 0.420 inches maximum

• Body Height

  0.045 inches minimum and 0.090 inches maximum

• Maximum Power Dissipation Rating

  1.04 watts

• Inclosure Material

  ceramic

• Input Circuit Pattern

  14 input

• (Non-Core Data) Word Quantity

  4096

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  60.00 nanoseconds maximum propagation delay time, low to high level output and 60.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  rom

• Terminal Type And Quantity

  24 flat leads

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 7.0 volts maximum power source

• Test Data Document

  96906-mil-std-883 standard