5962-8687501XB

Technical Characteristics

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Memory Device Type

  ram

• Bit Quantity (Non-Core)

  8192

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Input Circuit Pattern

  44 input

• Time Rating Per Chacteristic

  90.00 nanoseconds maximum propagation delay time, low to high level output and 90.00 nanoseconds maximum propagation delay time, high to low level output

• Features Provided

  static operation and hermetically sealed and burn in and monolithic and bidirectional

• Current Rating Per Characteristic

  50.00 milliamperes forward current, maximum peak total value not applicable

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Body Width

  0.510 inches minimum and 0.620 inches maximum

• Inclosure Configuration

  dual-in-line

• Case Outline Source And Designator

  d-14 mil-m-38510

• Body Height

  0.165 inches minimum and 0.210 inches maximum

• Maximum Power Dissipation Rating

  1.5 watts

• Word Quantity (Non-Core)

  1024

• Body Length

  2.435 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Terminal Type And Quantity

  48 printed circuit

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source