5962-89664023BX

Technical Characteristics

• Features Provided

  cascadable and burn in and monolithic

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Inclosure Configuration

  leadless flat pack

• Bit Quantity (Non-Core)

  512

• Terminal Type And Quantity

  28 leadless

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Overall Height

  0.100 inches maximum

• Body Width

  0.460 inches maximum

• Input Circuit Pattern

  14 input

• Overall Width

  0.460 inches maximum

• Case Outline Source And Designator

  c-4 mil-m-38510

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Word Quantity (Non-Core)

  64

• Body Height

  0.088 inches maximum

• Body Length

  0.460 inches maximum

• Overall Length

  0.460 inches maximum