ROM/PROM

Technical Characteristics

• Iii Overall Width

  0.800 inches minimum and 1.160 inches maximum

• Body Width

  0.300 inches minimum and 0.420 inches maximum

• Body Height

  0.045 inches minimum and 0.090 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Features Provided

  electrostatic sensitive and hermetically sealed and burn in and schottky and programmable

• (Non-Core Data) Word Quantity

  4096

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  40.00 nanoseconds maximum propagation delay time, low to high level output and 40.00 nanoseconds maximum propagation delay time, high to low level output

• (Non-Core Data) Bit Quantity

  32768

• Case Outline Source And Designator

  f-6 mil-m-38510

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Memory Device Type

  rom

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  24 flat leads

• Body Length

  0.640 inches maximum

• Maximum Power Dissipation Rating

  1.04 watts

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Inclosure Material

  ceramic

• Inclosure Configuration

  flat pack

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  14 input