ROM/PROM FAMILY 149

Technical Characteristics

• Iii Overall Height

  0.357 inches minimum and 0.432 inches maximum

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Inclosure Configuration

  dual-in-line

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Input Circuit Pattern

  16 input

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum propagation delay time, low to high level output and 250.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  rom

• Test Data Document

  96906-mil-std-883 standard

• Body Length

  1.490 inches maximum

• Body Height

  0.172 inches minimum and 0.217 inches maximum

• Maximum Power Dissipation Rating

  170.0 milliwatts

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  hermetically sealed and burn in and programmable and electrostatic sensitive and ultraviolet erasable

• Inclosure Material

  ceramic

• (Non-Core Data) Bit Quantity

  65536

• (Non-Core Data) Word Quantity

  8192

• Case Outline Source And Designator

  d-10 mil-m-38510

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  14.0 volts maximum power source

• Terminal Type And Quantity

  28 printed circuit