X2864BDMB-180
Microcircuits, Electronic
MICROCIRCUIT,MEMORY
X2864BDMB-180
5962 - Microcircuits, Electronic
MICROCIRCUIT,MEMORY
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Technical Characteristics
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Body Length
1.435 inches minimum and 1.485 inches maximum
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Body Width
0.515 inches minimum and 0.600 inches maximum
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Body Height
0.180 inches maximum
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Features Provided
hermetically sealed and burn in and erasable and programmable and w/enable and electrostatic sensitive
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Criticality Code Justification
feat
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Voltage Rating And Type Per Characteristic
-1.0 volts minimum power source and 6.0 volts maximum power source
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Memory Device Type
rom
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Operating Temp Range
-55.0 to 125.0 deg celsius
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Storage Temp Range
-65.0 to 150.0 deg celsius
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Inclosure Material
ceramic
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Inclosure Configuration
dual-in-line
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Output Logic Form
complementary-metal oxide-semiconductor logic
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Input Circuit Pattern
24 input
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(Non-Core Data) Bit Quantity
65536
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(Non-Core Data) Word Quantity
8192
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Terminal Surface Treatment
solder
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Time Rating Per Chacteristic
300.00 nanoseconds maximum propagation delay time, low to high level output and 300.00 nanoseconds maximum propagation delay time, high to low level output
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Special Features
item must comply with requirements of defense electronics supply center production standard no. l04220; for navy nuclear propulsion plant products only
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Test Data Document
96906-mil-std-883 standard
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Terminal Type And Quantity
28 printed circuit