914-3502-340

Technical Characteristics

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Dissipation Factor At Reference Temp In Percent

  0.200

• Body Style

  chip type

• Body Length

  0.085 inches minimum and 0.135 inches maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Tolerance Range Per Section

  -0.10/+0.10 picofarads single section

• Terminal Type And Quantity

  2 bonding pad

• Overall Length

  0.085 inches minimum and 0.135 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 175.0 deg celsius maximum

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Capacitance Value Per Section

  1.000 picofarads single section

• Case Material

  glass

• Body Height

  0.100 inches maximum

• Overall Width

  0.090 inches minimum and 0.130 inches maximum

• Body Width

  0.090 inches minimum and 0.130 inches maximum

• Terminal Length

  0.010 inches minimum and 0.030 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Overall Height (Non-Core)

  0.100 inches maximum

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms