5962-8951301BSB

Technical Characteristics

• Body Height

  0.045 inches minimum and 0.100 inches maximum

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Input Circuit Pattern

  10 input

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Case Outline Source And Designator

  f-9 mil-m-38510

• Body Width

  0.245 inches minimum and 0.300 inches maximum

• Terminal Type And Quantity

  20 flat leads

• Body Length

  0.540 inches maximum

• Storage Temp Range

  -65.0/+125.0 deg celsius

• Features Provided

  3-state output and hermetically sealed and burn in and monolithic

• Time Rating Per Chacteristic

  11.00 nanoseconds maximum propagation delay time, low to high level output and 11.00 nanoseconds maximum propagation delay time, high to low level output

• Inclosure Configuration

  flat pack

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Voltage Rating And Type Per Characteristic

  5.0 volts nominal power source

• Design Function And Quantity

  8 register, d-type

• Current Rating Per Characteristic

  -100.00 milliamperes collector cutoff current, dc, with specified resistance between base and emitter nominal and 100.00 milliamperes reverse current, dc nominal