C0805E221J1XAH

Technical Characteristics

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Body Length

  0.065 inches minimum and 0.095 inches maximum

• Terminal Length

  0.010 inches minimum and 0.030 inches maximum

• Capacitance Value Per Section

  220.000 picofarads single section

• Overall Width

  0.035 inches minimum and 0.065 inches maximum

• Overall Height (Non-Core)

  0.055 inches maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 without voltage applied single section

• Reliability Indicator

  not established

• Terminal Surface Treatment

  solder

• Body Height

  0.055 inches maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Terminal Type And Quantity

  2 bonding pad

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Body Width

  0.035 inches minimum and 0.065 inches maximum

• Overall Length

  0.065 inches minimum and 0.095 inches maximum

• Case Material

  ceramic

• Body Style

  chip type

• Dissipation Factor At Reference Temp In Percent

  2.500