8511874-757

Technical Characteristics

• Features Provided

  hermetically sealed and high speed and burn in and static operation

• Input Circuit Pattern

  26 input

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  1.0 watts

• Voltage Rating And Type Per Characteristic

  -0.5 volts maximum power source and 7.0 volts maximum power source

• Inclosure Material

  ceramic

• Body Width

  0.542 inches minimum and 0.558 inches maximum

• Inclosure Configuration

  leadless flat pack

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Memory Device Type

  ram

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  45.00 nanoseconds maximum propagation delay time, low to high level output and 45.00 nanoseconds maximum propagation delay time, high to low level output

• Word Quantity (Non-Core)

  32768

• Terminal Type And Quantity

  32 leadless

• Body Height

  0.074 inches minimum and 0.086 inches maximum

• Bit Quantity (Non-Core)

  262144

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  0.542 inches minimum and 0.558 inches maximum