TIBPAL16R8-30MWB

Technical Characteristics

• Case Outline Source And Designator

  f-9 mil-m-38510

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Maximum Power Dissipation Rating

  0.6 watts

• Inclosure Material

  ceramic

• Voltage Rating And Type Per Characteristic

  -0.5 volts maximum power source and 7.0 volts maximum power source

• Overall Width

  0.745 inches minimum and 1.040 inches maximum

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  20.00 nanoseconds maximum propagation delay time, low to high level output and 20.00 nanoseconds maximum propagation delay time, high to low level output

• Current Rating Per Characteristic

  12.00 milliamperes average forward current averaged over a full 60-hz cycle not applicable

• Body Height

  0.045 inches minimum and 0.100 inches maximum

• Body Width

  0.245 inches minimum and 0.300 inches maximum

• Terminal Type And Quantity

  20 flat leads

• Body Length

  0.540 inches maximum

• Features Provided

  3-state output and monolithic and programmable and w/clock and bipolar and w/enable

• Memory Device Type

  pal

• Inclosure Configuration

  flat pack

• Input Circuit Pattern

  16 input

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Output Logic Form

  bipolar metal-oxide semiconductor