STSWDC04-3

Technical Characteristics

• Precious Material And Location

  eutectic die bonds surfaces terminals and land areas surfaces gold

• Current Rating Per Characteristic

  20.00 milliamperes forward current, average absolute all semiconductor device diode

• Semiconductor Material

  silicon all semiconductor device diode

• Mounting Method

  terminal

• Component Name And Quantity

  2 semiconductor device diode

• Voltage Rating In Volts Per Characteristic

  60.0 maximum reverse voltage, dc all semiconductor device diode

• Precious Material

  gold

• Overall Width

  0.037 inches minimum and 0.043 inches maximum

• Terminal Type And Quantity

  4 bonding pad

• Special Features

  all semiconductor device diode junction pattern arrangement: pn

• Overall Length

  0.072 inches minimum and 0.078 inches maximum

• Overall Height

  0.030 inches minimum and 0.040 inches maximum