EDI8810L150DB

Technical Characteristics

• Test Data Document

  7.5 grams

• Iii Unpackaged Unit Weight

• Memory Device Type

  -55.0 to 125.0 deg celsius

• Time Rating Per Chacteristic

  150.00 nanoseconds maximum propagation delay time, low to high level output and

• ~1

  ram

• Terminal Surface Treatment

  dual-in-line

• Word Quantity

  8192

• Bit Quantity

  65536

• Features Provided

  static operation

• Features Provided

  monolithic and

• Features Provided

  96906-mil-std-883 standard

• Maximum Power Dissipation Rating

  -65.0 to 150.0 deg celsius

• Body Height

  0.357 inches minimum and

• Body Width

  0.432 inches maximum

• Terminal Type And Quantity

  solder

• ~1

  150.00 nanoseconds maximum propagation delay time, high to low level output

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Input Circuit Pattern

  25 input

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Inclosure Configuration

  ceramic

• Inclosure Material

  1.490 inches maximum

• Features Provided

  burn in and

• Storage Temp Range

  hermetically sealed and

• Operating Temp Range

  28 printed circuit

• Body Height

  0.217 inches maximum

• Body Width

  1.0 watts

• Body Length

  0.172 inches minimum and