6116S70L/B

Technical Characteristics

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Body Width

  0.442 inches minimum and 0.460 inches maximum

• Inclosure Configuration

  leadless flat pack

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Word Quantity (Non-Core)

  2048

• Features Provided

  burn in and hermetically sealed and static operation and positive outputs

• Terminal Type And Quantity

  24 printed circuit

• Body Height

  0.060 inches minimum and 0.075 inches maximum

• Bit Quantity (Non-Core)

  16384

• Case Outline Source And Designator

  c-4a mil-m-38510

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum propagation delay time, low to high level output and 70.00 nanoseconds maximum propagation delay time, high to low level output

• Input Circuit Pattern

  22 input

• Body Length

  0.442 inches minimum and 0.460 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius